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Protect IP and deploy secured connected systems with Microchip’s new CryptoAuthentication device and Security Design Partner Program

CryptoAuthentication device
From remote cyber-attacks to the creation of counterfeit products, security threats are wide-spread and affect all industries. When carried out, these threats can translate into substantial losses in recovery costs, service revenue and perhaps most significantly, in brand equity. Implementing robust security into new and existing designs to protect Intellectual Property (IP) and enable trusted authentication of connected devices...

Record Growth Continues as Solar Installations in India Reach 2.2 GW in Q3 2017

Solar Installations
Key Highlights from Mercom India Research’s Q3 2017 India Solar Market Update: India installed 2,247 MW of solar projects in Q3 2017, up 15 percent from Q2 2017 With over 7 GW of cumulative installations in the first nine months (9M) of 2017, solar is now the leading new energy source in India, accounting for 39 percent of total new...

IoT Edge Computing

edge computing
The Internet of Things is a constantly evolving confluence of technologies. Right now, a range of ecosystem stakeholders are taking a close look at how distribution of computing infrastructure to the network edge, supported by an end-to-end architecture connecting edge infrastructure to cloud services, can support IoT use cases. One way to think about it is the edge as...

Ametherm Glass-Encapsulated Thermistors for Automotive and Industrial Applications Now in Stock at Digi-Key

Ametherm Glass-Encapsulated Thermistors
Ametherm, announced that its DG series of glass-encapsulated thermistors for high-accuracy temperature sensing in automotive and industrial applications is now in stock at Digi-Key. Hermetically sealed DG series devices eliminate errors in resistance readings due to moisture penetration while offering high operating temperatures and a compact size. Ametherm's glass-encapsulated DG series provides designers with faster, more accurate, and less expensive...

India expands its connectivity with Hyperloop

Hyperloop in India
California’s horrorshow traffic can be the reason for Elon Musk to think about the idea of the fifth transportation system( Cars, Trains, Flights, boats and now Hyperloop)  but being stuck in Indian metropolitan cities traffic might have given him another reason. India with massive population and mass transit to commute through landscape needs the speed to connect.  India has...

Synopsys Announces New Release of LucidShape CAA V5 Based Software for Automotive Optical Simulation and Analysis

synopsys
Highlights: Support for configuring and running multiple optical simulations improves the efficiency of analyses for a range of automotive lighting functions, from high and low beams to signal lighting A ray history sensor feature added to the Luminance Camera Sensor reduces design iterations needed to meet lit appearance and regulatory requirements The Light Guide Design Module offers expanded capabilities...

HID Global Wins Award for Deployment of Its Cloud-based ID Personalization and Issuance Solution at Kent State University

HID Global
HID Global, a worldwide leader in trusted identity solutions, announced it has won the 2017 SSI Security Solutions award for the successful deployment of its new HID FARGO Connect offering at Kent State University. The new cloud-based ID personalization and issuance solution has dramatically simplified and forever changed how the university manages its high-volume ID card issuance requirements. “HID FARGO Connect...

Resins Past, Present and Future: Keeping Pace With a Fast-Moving Industry

Electrolube logo
I have been working with polymers and resins for more than 20 years now and, modesty aside, have been involved in a number of significant developments ranging from structural composite resin and pre-preg systems for the aerospace and automotive industries, to my current activities with Electrolube and a strong team of chemists, formulating new resins for the protection of...

TI DLP Technology Enables Next-Generation Augmented Reality Head-up Displays

DLP Technology
Texas Instruments (TI) today unveiled the next evolution of DLP technology for in-vehicle head-up display (HUD) systems. The new DLP3030-Q1 chipset, along with supporting evaluation modules (EVMs), gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver’s line of sight. Designers can take advantage of the automotive-qualified...

Cypress Semiconductor PSoC 6 BLE Pioneer Kit Now In Stock at Digi-Key

PSoC 6 BLE Pioneer Kit
Customers who opted in to be early adopters of the Cypress Semiconductor PSoC 6 BLE Pioneer Kit through Digi-Key Electronics, a global electronic components distributor,will be seeing the product arrive at their doors shortly.The company has received their highly-anticipated stock and have begun processing and shipping customer pre-orders. Cypress' PSoC 6MCU is an IoT game changer. It delivers the ultra-low-power, high-performance,...

Interview