Electronicsmedia

EIT Digital scaleup DigiFlak, the Estonian manufacturer of USB / NFC devices for strong password-free multifactor network access authentication and U.S. Cryptographic Appliance manufacturer Engage Black, have successfully integrated Engage Black’s BlackVault Certificate Authority (CA) with DigiFlak’s Secuters. The companies can now start offering a combined solution for certificate management and communication protection for IoT and Smart Contracts projects. DigiFlak...

Highlights: S-Matrix/PDK Generation Utility for efficient, multi-level photonic integrated circuit design and analysis Increased simulation speeds of silicon photonics components by 100x or more Interface with Synopsys' HSPICE software for cohesive, precise modeling of optoelectronic circuits Synopsys, Inc., announced the release of version 2017.09 of the Synopsys RSoft product portfolio, the company's industry-leading family of software tools for photonic component and...

Telit, a global enabler of the Internet of Things (IoT), announced it is collaborating with Wind River, an Intel company, to accelerate Industrial IoT (IIoT) adoption. Through this relationship, Telit and Wind River are reducing the complexities of IoT device management, helping companies quickly and securely realize the full solution benefits of IIoT. Wind River is utilizing Telit’s IoT platform...

Zyxel Communications will showcase the world’s leading Managed WiFi Solution – enabling service providers to deliver seamless whole-home WiFi with exceptional user experience quickly and cost-effectively – at this year’s Broadband World Forum. The premium “Multy Pro” Managed WiFi Solution features high performance gateways with WiFi excellence, optimal combinations of hardware and software, as well as a WiFi mesh system...

A three-year National Science Foundation grant totaling nearly $1 million will let West Virginia University develop its next-generation High Performance Computing, or HPC, cluster to advance computationally intensive research in a wide array of fields, from drug delivery to genomics and astrophysics. The design and implementation of the new computing cluster will be funded by a $990,000 NSF Major Research Instrumentation Program, known as...

Smart Industry Conference 2017, organized by the Ethernet POWERLINK Standardization Group, brought together over 100 delegates and 12 industry experts, who shared their experiences and recommendations on various Industrial IoT and Industry 4.0 topics such as digitalization in manufacturing, technological trends and business model transformation.HMS India, Utthunga Technologies, Ascent Intellimation, A&D India and B&R Industrial Automation organized the joint...

“Smart Industry” isn’t a random label one can just throw around, but the current industrial revolution brought upon by a sophisticated and precise set of technologies that are changing man’s relation to manufacturing. Read More...

For those who are asking why we haven't seen flying cars in our current reality just yet—they might be coming sooner than you think. The aviation company Airbus just announced they will unveil a self-flying electric vehicle sometime next year. This will be Airbus' first step in launching an automated flying taxi service. Airbus successfully tested the prototype for the multi-passenger, electric...

Cloud, mobile and social engagement are driving a digital disruption that’s revolutionizing business. Individuals are more connected than ever before, taking advantage of more diverse channels of engagement. Readily available digital technologies have empowered consumers to expect more from their service providers (financial institutions, government, retailers and so on). They want faster, more transparent ways of doing business as...

Molex has added three new terminals plus the Mini50 sealed connector following the launch of its highly popular Mini50 Wire-to-Board Connector System. Designated as TAK50 terminal, CTX50 unsealed gold terminal, and CTX50 sealed terminal, these new terminals enable vehicle manufacturers to take advantage of miniaturized interconnect systems in both interior (unsealed) and exterior (sealed) applications. “Manufacturers are adding more electronic features to...