ULVAC Launches New Deposition System for Semiconductor Applications: Model “ENTRON-EXX”
ULVAC, Inc. (HQ: Chigasaki, Kanagawa) has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications. The ENTRON-EXX builds on the proven productivity and flexibility of its predecessor, the ENTRON-EX W300, while offering enhanced data intelligence and expandability.
After building on the proven productivity and flexibility of the widely adopted...
Astrolight Advances Laser Communication Tech in Market Set for $15B Expansion and 40% Growth
The demand for faster, more secure communication systems has led to a surge in the satellite laser communications market, expected to grow at a compound annual growth rate (CAGR) of 40% from 2024 to 2032. According to experts from Astrolight, a space tech company that provides dual-use lasercom solutions, the demand for optical connectivity in low Earth...
PDR Offers Advanced Infrared Heating Technology for BGA Rework
PDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.
At the heart of PDR’s product line is the PDR IR-E3 Rework Station,...
Infineon wins German Sustainability Award 2025
Highlights:
Infineon wins prestigious award in the category "Electrical Engineering and Electronics".
The company makes significant progress in implementing its ambitious sustainability strategy.
German Sustainability Award is Europe's largest award for ecological and social commitment.
Infineon Technologies AG – has won...
Printed Circuit Board (PCB) Assembly Market to reach USD 145 billion by 2032
Global Printed Circuit Board (PCB) Assembly Market was valued at USD 90 billion in 2023 and is projected to be worth USD 145 billion by the end of 2032, according to recent report by Global Market Insights Inc.
Global Printed Circuit Board PCB Assembly Market will depict over 5% CAGR from 2024 to 2032,...
Mitsubishi Electric’s Swedish Subsidiary Signs a Share Transfer Agreement to Wholly Acquire Norwegian Elevator Company ALT Heis
Mitsubishi Electric Corporation announced that it acquired all shares of Norwegian elevator company ALT Heis (headquartered in Bergen, Norway) on November 29 through its wholly owned subsidiary, Motum (headquartered in Stockholm, Sweden).
Mitsubishi Electric and Mitsubishi Electric Building Solutions Corporation (hereafter, MEBS) are aiming to expand their elevator maintenance business globally, and the present acquisition follows...
First R-Car Gen 5 SoC Optimizes Software-Defined Automotive Computing Design
Earlier this month at electronica 2024 in Munich, Germany, I had the pleasure of speaking to a group of international journalists to introduce our fifth-generation (Gen 5) R-Car system-on-chip (SoC) for software-defined vehicle (SDV) design.
SDV platforms are reinventing the automotive value chain by incentivizing designers to overturn the industry's conservative heritage of methodical...
The road to 100% renewable electricity: making progress on our sustainability commitments
Employees on our Environment, Safety, Health and Sustainability team provide a behind-the-scenes look at how our company is expanding its use of renewable electricity to create a sustainable future
An hour south of Dallas, acres of solar panels stretch as far as the eye can see, absorbing the sun's energy and converting it to...
WotNot exposes 346K sensitive customer files
Introducing additional hands into the AI supply chain might not be such a great idea. Passports, detailed medical records, resumes, and other sensitive personal records were exposed in a database belonging to WotNot, an Indian AI startup that helps build and customize bots for businesses.
ChatGPT and other chatbots from major AI companies have...
Demo: Multi Board Synchronization on RFSoC Board & Systems
The Zynq UltraScale+ RFSoC architecture integrates FPGA fabric with flexibility and the architecture to support direct RF-sampling, highly flexible, reconfigurable logic, and software programmability. This feature is applicable in applications that involve rapid data acquisition, high-speed digital signal processing, and efficient RF communication. Examples include phased array radars, 5G and Wireless systems, radio telescopes, test and measurement equipment.
















