Showa Denko to Supply SiC Epitaxial Wafers to Toshiba
Showa Denko K.K. concluded a long-term supply contract with Toshiba Electronic Devices & Storage Corporation (Toshiba), a Japanese electronic device manufacturer providing...
From Sand to Circuits – How Processors are made
Have you ever imagined what is in the core of Silicon chips that power the world, how the sand we see in...
Silicon Designs MEMS Capacitive Accelerometer Chips are now available for immediate Customer Shipment
Silicon Designs announced that three of its industry best-selling industrial-grade surface mount MEMS capacitive accelerometer chip families are now available for immediate...
ROHM developed new SerDes ICs & PMIC for Automotive Satellite Camera Modules
Providing solutions that reduce EMI & power consumption in increasingly sophisticated ADAS
ROHM developed SerDes ICs (BU18xMxx-C series) and...
Infineon opens 300-millimeter thin wafers Fab
Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in...
Power Integrations reveals SCALE-iFlex Single Plug-and-Play Gate Drivers for “New Dual” Modules
SCALE-2 technology optimizes footprint, improves efficiency, performance & reliability of power inverters & converters to 3300 V
Power Integrations...
Silicon Labs host industry leaders for panel on Global Semiconductor shortage at IoT ‘Works...
Global Semiconductor Alliance, ASE, Inc., Arrow Electronics and Silicon Labs to address what's ahead
Silicon Labs announced a Works...
Reversible Computing is an Intriguing Issue in the Advanced Period of Innovation
In this period of nanometer semiconductor nodes, the transistor scaling and voltage scaling aren't in line with each other which defined the failure...
Spirent & Synopsys Collaborate to Accelerate the Silicon Development Time-to-Market
New Networking SoC Test Solution Bridges the Gap Between Pre-Silicon and Post-Silicon Verification
Spirent Communications plc announced a collaboration...
Infineon and Panasonic accelerate GaN technology development for 650 V GaN power devices
Infineon Technologies AG and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2)...
