Analog Devices Secures Long-Term Wafer Capacity via Partnership with TSMC
Analog Devices, Inc. announced the company has made a special arrangement with TSMC, the world's leading dedicated semiconductor foundry, to supply long-term...
Advancing Precision – Innovations in Semiconductor Metrology and Inspection Propel Industry Forward
Semiconductor Metrology and Inspection - Technological advances semiconductor metrology and inspection have been driven by teh constant demand for smaller, faster, and...
Bluetooth Low Energy SoC representing Renesas’ lowest power consumption and smallest, multi-core
Renesas Electronics Corporation introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas' lowest power consumption and smallest, multi-core (Cortex-M33,...
Silicon Box starts Production Commencement at its Advanced Packaging Facility and Series B Fundraising
Silicon Box revealed its advanced $2B packaging factory in Singapore has been in mass production for early customers since October 2023, shortly...
Nuvoton Unveils Endpoint AI Platform for Next-Gen Microcontroller AI Products
Nuvoton is pleased to announce its new Endpoint AI Platform to accelerate the development of fully-featured microcontroller (MCU) AI products. These solutions...
CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost
CEA-Leti has developed a 200mm gallium nitride/silicon (GaN/Si) process technology compatible with CMOS cleanrooms that preserves the high performance of the semiconductor material...
Dark Field Wafer Defect Inspection System for High Throughput and High-Precision
Hitachi High-Tech Corporation launched the Hitachi Dark Field Wafer Defect Inspection System DI4600 – a new tool for inspecting particles and defects...
Amkor Announces US Advanced Packaging and Test Facility
Amkor Technology has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project...
Nexperia and Mitsubishi Electric agree on strategic partnership for discrete SiC MOSFETs
Nexperia has entered into a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFETs. This collaboration will see Nexperia...
Nexperia and Mitsubishi Electric agree on strategic partnership for discrete SiC MOSFETs
Nexperia announced that it has entered into a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFETs. This collaboration...
