Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles
Infineon Technologies AG and HL Klemove have signed a Memorandum of Understanding (MoU) to strengthen their strategic collaboration in automotive technologies. The...
Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimized for...
To support continued growth of connected devices in home, industrial and commercial markets, Infineon Technologies AG introduced the AIROC ACW741x, a new...
Silanna Announces MIL-TEMP Variant of Plural Platform ADCs, Delivering −55°C to +125°C Operation Across...
MIL-TEMP Variant of Plural Platform ADCs:
Silanna Semiconductor, a global provider of high-performance mixed-signal solutions, announced MIL-TEMP variants...
Vishay Transmissive Sensors Offer Greater Vertical Headroom and Design Flexibility for Industrial and Consumer...
Vishay Intertechnology, Inc. announced that it has expanded its transmissive sensor family with the introduction of two new surface-mount devices for industrial,...
Iluvatar CoreX Soars by 31.54% in Trading Debut: ‘Genuine Leader’ of Domestic AI Computing...
Shanghai Iluvatar CoreX Semiconductor Co., Ltd. (“Iluvatar CoreX”, stock code: 9903.HK), the highly anticipated Chinese GPGPU chip design company, officially commenced trading...
Marvell to Acquire XConn Technologies, Expanding Leadership in AI Data Center Connectivity
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it has entered into a definitive agreement to acquire XConn Technologies...
Silanna, Avnet Enter Distribution Partnership for Advanced Plural ADC Portfolio and Ultra-Efficient FirePower Laser...
Silanna-Avnet Distribution Partnership:
Silanna Semiconductor, a global leader in analog innovation, announced a strategic franchise agreement with Avnet....
Ambiq Unveils Atomiq, the World’s First Ultra-Low Power NPU SoC Built on SPOT
Ambiq Micro, Inc. (“Ambiq”), a recognized leader in ultra-low-power semiconductor solutions for edge AI, announced Atomiq, the highly anticipated system-on-chip (SoC) integrating...
Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026
Key Highlights:
Synopsys will support the Fédération Internationale de l'Automobile (FIA), the global governing body for motorsport...
YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium
YINCAE Advanced Materials, a leading supplier of high-performance materials for advanced semiconductor packaging, will showcase its latest wafer-level packaging solutions at the...
