Infineon’s EZ-USB FX10 controller unlocks performance acceleration of 5-meter passive metal cable by 3M...
Infineon Technologies AG, a global semiconductor leader in power systems and IoT, and 3M collaborate to introduce a new 5-meter passive metal...
onsemi Launches New Cooling Packaging Technology to Drive Efficiency in Power-Hungry Applications
EliteSiC MOSFETs:
What’s New: onsemi announced the release of its EliteSiC MOSFETs in the industry-standard T2PAK top-cool package, advancing power packaging for automotive and industrial applications. This...
onsemi and Innoscience Announce Plans to Collaborate to Speed Global Rollout of GaN Power...
Summary: onsemi announced it has signed a memorandum of understanding with Innoscience to explore expanding production of gallium nitride (GaN) power devices...
The Semiconductor Technology shaping the Autonomous Driving experience
Autonomous Driving: The vehicle of the future will be more autonomous, making driving less stressful. But how will design engineers get there?
5.5V, 4A, Low IQ Synchronous Buck Converter with Versatile I2C Interface from Diodes Incorporated is...
Diodes Incorporated (Diodes) introduces the AP61406Q, a new 5.5V, 4A member with I2C interface of its low quiescent current (IQ), automotive-compliant synchronous buck...
Automotive Display Semiconductors Market to Surpass USD 72.45 Billion by 2034
The global automotive display semiconductors market was valued at USD 13.4 Billion in 2024 and is estimated to grow at a CAGR...
Infineon enhances Electreon’s electric road charging with high-power silicon carbide technology
Electric road system charges buses and trucks as they drive along streets and highways
Customized silicon carbide...
Now at Mouser: ROHM Semiconductor RY7P250BM Power MOSFET for Data Center, AI, and Industrial...
Mouser Electronics, Inc., the authorized global distributor of the newest electronic components and industrial automation products, is now offering the new RY7P250BM power MOSFET...
STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip
ST25DA-C chip:
Matter 1.5 enhances the consumer experience at home with right-first-time NFC onboarding of multiple...
ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability
ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with...
