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RTG4 FPGAs

Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification

Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free...
Lid angle detection

Lid angle detection with 2 ST sensors or the better way to track hinges...

What if the industry has been doing lid angle detection all wrong, and the solution wasn’t to use magnets? The claim is bold,...
Negar Souri-Amlashi

HybridPACK Drive G2 Fusion: World’s first power module combining silicon and silicon carbide technology

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market. That's why Infineon...
eSIMs

Why eSIMs are Becoming the Preferred Choice for Business Owners

Amidst the rapid advancements in technology, businesses are actively exploring ways to modernize their operations and boost efficiency. One innovative development that...
Silicon Labs

Silicon Labs Series 3 Platform Guides the Evolution of the IoT

Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, delivered the opening keynote for the inaugural embedded...
hitachi

Oita University and Hitachi High-Tech Give a Joint Presentation on the Use of AI...

National University Corporation OITA UNIVERSITY ("Oita University") and Hitachi High-Tech Corporation ("Hitachi High-Tech") announced that we have started conducting research ("this research")...
Fujitsu Technology and Service Vision 2026

Fujitsu leverages data to secure stable and efficient power supply for Kansai Transmission and...

Fujitsu announced that it is developing a system based on “Fujitsu Data Intelligence PaaS” to realize a stable and efficient power supply...
Wi-Fi 7

Testing Wi-Fi 7 for High-Performance Use Cases

The latest advancements in Wi-Fi 7 are poised to unleash a new wave of applications and drive adoption of innovative new devices....
The Next Leap in Semiconductors

The Next Leap in Semiconductors: Advancements Towards the 1.4nm Process Node

We haven't yet reached 2025, the expected arrival year of the 2nm process node, but we're already talking about the 1.4nm node.
STMicroelectronics and Qualcomm enter strategic collaboration in wireless IoT

STMicroelectronics and Qualcomm enter strategic collaboration in wireless IoT

Highlights: Strategic collaboration will pair STMicroelectronics' market-leading STM32 microcontroller ecosystem and Qualcomm's world-leading wireless connectivity solutions.

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