PIC International 2017 welcomes more industry leaders and rising stars driving the next generation of photonic integrated circuits

the second PIC International conferenceto be held at the Sheraton Airport Hotel in Brussels grows to a new auditorium featuringspeakers across the entire value chain of the photonic integrated circuits industry.

Conference delegates will hear almost 40 talks that have been divided into five core themes impacting the PIC community. Talk sessions range from supporting data centre growth and exploring new markets such as fibre sensing & life sciences to optimising PIC design, manufacturing & packaging, PIC platforms and leveraging PICS in long-haul & metro networks. Each theme includes a keynote presentation, plus presentations from leading market analysts

PIC International 2017 welcomes more industry leaders and rising stars driving the next generation of photonic integrated circuits

“As well as many great presentations to look forward to, from the likes of Intel, Hewlett-Packard Enterprise, IBM the European Space Agency and Huawei, there will be many companies to talk to at the exhibition,” comments James Tyrrell, Conference Programme Manager and Editor of PIC Magazine. “Those conversations could be very valuable, as they could lead to opportunities to meet other key players across the entire value chain of the photonics integrated circuits industry.”

Next generation of photonic integrated circuits
As Conference Chair Michael Lebby notes: “The timing could not be better – the PIC movement is accelerating into new and innovative products, and the technology infrastructure to support PIC design, modeling, fabrication, testing, and qualification is being built-out quickly and efficiently. The 2nd PIC conference brings together the best companies and senior engineers and decision makers of this PIC movement that looks to grow significantly in numbers, interest, and impact over the first conference in 2016.”
Another highlight of PIC International will be the inaugural PIC Awards ceremony at the end of Day One. This will serve to recognise and highlight key industry achievements in advancing photonic integration through platform development, manufacturing, design, packaging and device characterisation.
For more information visit: http//www.picinternational.net

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