Semiconductor Packaging Materials – Semiconductor Packaging Materials – Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling solder products at the IMAPS Symposium, September 29-30, in Boston, Massachusetts.
The company will feature the following products:
- Heterogeneous Integration Assembly (HIA) is a full materials suite that meets the stringent requirements of advanced packaging technology, from fine-powder paste, flip-chip flux, and ball-attach flux, to various options of thermal interface materials (TIMs).
- InFORCE®29 is a range of pressure Cu-sintering pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- SiPaste® C312HF is a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use, and a long stencil life of at least four hours without dry-out. Its benign, non-corrosive residue can remain post-reflow without cleaning or be easily removed with semi-aqueous or saponifier technology.
- InBAKE™29 is a Cu-sintering paste developed for power discrete die-attach applications and other applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
- Solder Thermal Interface Materials (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, sTIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
For more information visit: indium.com.
