MIPI released I3C Basic Interface Specification for broader developer community
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, released MIPI I3CBasic v1.0, a subset of the MIPI I3C specification that bundles the...
World’s first industrial-grade eSIM in miniaturized package by Infineon
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile...
AppNeta and AAEON Partner on Network Monitoring Platform at 100 Gbps Speeds
AppNeta, the leader in actionable, end-to-end network performance monitoring from the end-user perspective, and AAEON, the leading designer and manufacturer of network appliances, today announced...
Anritsu and Qualcomm Complete 5G Standalone (SA) Connection Test
Anritsu Corporation announced the successful completion of 5G Standalone (SA) connection testing between Anritsu’s Radio Communication Test Station MT8000A and a mobile smartphone form-factor test device...
ON Semiconductor’s Smart Passive Sensors Awarded For Outstanding Technical Innovation
ON Semiconductor has been awarded an IoT Outstanding Technical Innovation Award for its Smart Passive Sensors (SPS). SPS are wireless and battery-free sensors that enable the monitoring...
Mouser Signs Global Agreement to Distribute nvSRAM Products from Anvo-Systems Dresden
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, today announced it has entered into a global distribution agreement with Anvo-Systems...
SPICE compact models for circuit design using nanowire & nanosheet technologies
Leti, a research institute of CEA-Tech, and Silvaco Inc., a leading global provider of software, IP and services for designing chips and electronic systems...
Industry’s First 300mm SiGe Foundry Technology to Meet Growing Data Center & High-Speed Wireless...
GLOBALFOUNDRIES announced its advanced silicon germanium (SiGe) offering, 9HP, is now available for prototyping on the company's 300mm wafer manufacturing platform. The move signifies the strong...
MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC
Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec's 16FFC Temperature Sensor IP...
Infineon and IDEX Biometrics: Working together to advance biometric card landscape
Working together to advance the biometric card landscape: Infineon Technologies AG and IDEX Biometrics, the leading provider of advanced fingerprint identification and authentication solutions...
