Rohde & Schwarz presents its advanced solutions for power electronics testing and characterization at PCIM Expo 2025
PCIM Expo 2025
Rohde & Schwarz will showcase its latest solutions and advanced techniques for testing and analyzing power electronic systems and components at PCIM Expo 2025 in Nuremberg, Germany. At the company’s booth (hall 7, booth 166), the spotlight will be on solutions utilizing the company’s cutting-edge test instruments to address the challenges...
Würth Elektronik Launches new Development Kit
Würth Elektronik is excited to announce the launch of the SN6507 Development Kit , featuring the Texas Instruments (TI) SN6507EVM. This comprehensive solution is designed to help engineers evaluate the performance of TI’s SN6507 transformer driver for isolated power supplies, featuring Würth Elektronik’s WE-PPTI transformer line. The development kit includes two versatile boards and 16 transformer samples,...
SuperLight Photonics Expands Global Footprint through Strategic Distribution Partnership with Precision Technologies in Singapore
SuperLight Photonics, renowned for groundbreaking advancements in PIC (Photonics IC) wideband laser technology, is excited to announce its partnership with Precision Technologies Pte Ltd, Singapore's premier photonics distributor.
This collaboration marks a significant step in strengthening SuperLight Photonics’ presence in Southeast Asia region, ensuring better access to its leading-edge laser and photonics technologies for customers in Singapore,...
Nexperia now offers automotive planar Schottky diodes in space-saving CFP2-HP packaging
Nexperia announced that it is now offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrial (e.g. PMEG6010EXD), as well as eight AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, especially in automotive applications....
SemiQ to Showcase Third-Generation SiC and Wide Range of 1200 V SiC MOSFETs and Modules at PCIM 2025
SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, will showcase several advances relating to high power SiC MOSFETs and modules at PCIM 2025.
PCIM takes place in Nuremberg from the 6th to the 8th May, with SemiQ partnering with alfatec to demonstrate its technology,...
Asahi Kasei Microdevices and Silicon Austria Labs achieve proof of concept for integrating current sensor into power module – Enabling downsizing and more efficient traction inverters for electric vehicles
Asahi Kasei Microdevices Corporation (AKM) and Silicon Austria Labs GmbH (SAL) have successfully completed a joint proof of concept for integrating a current sensor into a power module to be used in automotive applications such as traction inverters and DC-DC converters. This technology enables energy efficiency, as well as compact and lightweight design for ultra-high current applications...
Netskope advances AI security with new DSPM innovations as part of Netskope One’s holistic AI protection capabilities
Netskope, a leader in modern security and networking, announced the continued expansion of the Netskope One platform to cover more AI security use cases, including enhanced protections for private applications and data security posture management (DSPM) attributes. While other vendors focus on enabling safe user access to AI applications, Netskope capabilities go much further by managing new...
Keysight Awarded NATO FORACS Contract to Enhance Operational Readiness
Keysight Technologies, Inc. has been awarded a contract with NATO's Naval Forces Sensor and Weapons Accuracy Check Sites (FORACS) to modernize its testing capabilities for critical radar and electronic support measures (ESM) systems. Under this agreement, Keysight will deliver Radar Target Generator and Electronic Warfare testing (EW) solutions to be deployed at NATO Navy bases, enabling the calibration...
Effortless Integration: RECOM Products Now Available in EPLAN
RECOM EPLAN integration
RECOM is excited to announce a strategic cooperation with EPLAN, a leading provider of CAE (Computer-Aided Engineering) solutions. This partnership enables our customers and engineers to effortlessly integrate key RECOM products into their electrical switchgear and cabinets designs using the EPLAN platform.
With this collaboration, RECOMs automation power...
TopLine’s President, Martin Hart, to Present at CMSE 2025 Conference April 30
Braided Solder Columns are the revolutionary, robust new solution to manufacturing challenges posed by next generation large packages in electronics assembly. Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present "Braided Solder Columns for Next Generation Large Heterogeneous 2.5D Packages" at the CMSE 2025 conference and exhibition at the...