Vishay Intertechnology Upgrades TFBS4xx and TFDU4xx Series IR Transceiver Modules With Longer Link Distance...
Vishay Intertechnology, Inc. announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA applications to offer 20 % longer...
India to Start Three more Semiconductor Units within next 100 days
29 FEB 2024, PIB Delhi
The Union Cabinet chaired by Prime Minister Shri Narendra Modi approved the establishment of...
Infineon introduces CoolSiC MOSFET G2
Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC)...
CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced...
CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation...
Analog Devices Secures Long-Term Wafer Capacity via Partnership with TSMC
Analog Devices, Inc. announced the company has made a special arrangement with TSMC, the world's leading dedicated semiconductor foundry, to supply long-term...
Advancing Precision – Innovations in Semiconductor Metrology and Inspection Propel Industry Forward
Semiconductor Metrology and Inspection - Technological advances semiconductor metrology and inspection have been driven by teh constant demand for smaller, faster, and...
Bluetooth Low Energy SoC representing Renesas’ lowest power consumption and smallest, multi-core
Renesas Electronics Corporation introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas' lowest power consumption and smallest, multi-core (Cortex-M33,...
Silicon Box starts Production Commencement at its Advanced Packaging Facility and Series B Fundraising
Silicon Box revealed its advanced $2B packaging factory in Singapore has been in mass production for early customers since October 2023, shortly...
Nuvoton Unveils Endpoint AI Platform for Next-Gen Microcontroller AI Products
Nuvoton is pleased to announce its new Endpoint AI Platform to accelerate the development of fully-featured microcontroller (MCU) AI products. These solutions...
CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost
CEA-Leti has developed a 200mm gallium nitride/silicon (GaN/Si) process technology compatible with CMOS cleanrooms that preserves the high performance of the semiconductor material...
