Mouser Publishes E-books on Revolutionary Technology As Part of Popular Shaping Smarter Cities Series
Mouser Electronics Inc., the authorized global distributor with the newest semiconductors and electronic components, announces a series of compelling e-books that provide in-depth views of...
Teledyne HiRel Electronics Adopts Adesto Technologies Resistive RAM Technology (CBRAM) for Aerospace and Defense...
Adesto Technologies, a leading provider of application-specific, ultra-low power non-volatile memory products, announced that Teledyne HiRel Electronics has adopted its resistive RAM (CBRAM) resistive...
Iridium’s New, Truly Global Broadband Service – Iridium Certus(SM) – Goes Live for On-Orbit...
Iridium Communications Inc., announced that it has begun live testing of the Iridium Certus service on operational Iridium NEXT satellites. Iridium Certus will be...
New Embedded Test and Programming Interface
With TIC022-MUX/SR, GOEPEL electronic presents a new external TAP interface card (TIC) for operation with the Embedded JTAG Solutions platform SCANFLEX. The module serves...
Telit Simplifies Migration to NBIoT with New Module in the xL865 Family
Highlights:
NL865B1-E1 LTE NB-IoT module is compatible with popular 2G and 3G xL865 family members
Square 24.4mm form factor in 48-pad QFN package is...
Eltek launches the Flatpack2 SHE, a Super High Efficient power conversion module with the...
The quest for improved power conversion efficiency and reduction of energy losses is always on. In close co-operation with Infineon Technologies AG, Eltek engineers...
Synopsys Delivers Industry’s First USB 3.2 Verification IP and Test Suite for Higher Performance...
Synopsys, Inc., announced the availability of the industry's first verification IP (VIP) and UVM source code test suite to support the latest USB 3.2...
Renesas Delivers R-Car Reference Package for Android Supporting Android 8.0
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the availability of the R-Car reference package for Android for Renesas R-Car automotive...
To encapsulate or to coat: that is the question
Potting compounds and encapsulation resins are generally two-part systems, in which a resin is mixed with a hardener in a precise ratio to form...
Manufacturing Industry Digital Innovation Hubs Set The Path to Digitise European Manufacturing Industry
EIT Digital together with 20 partners starts the Manufacturing Industry Digital Innovation Hub (MIDIH) initiative. Funded by H2020 within the Factories of Future cPPP...
