Anritsu’s MT8000A 5G Tester Contributes to Verify the Advanced Technologies of MediaTek’s 5G Modem

MT8000A confirmsMediaTek Helio M70 readiness for5G rollout

Anritsu today announced MediaTek‘sHelio M70 5G modem has achievedthe maximum downlink and uplink throughput using Anritsu’s Radio Communication Test StationMT8000A, providing a flexible test platform for ultrafast, large-capacity 5G communications usingwideband signal processing and beamforming.With its cutting-edge NSA and SA modes, the all-in-one MT8000A supportssub-6 GHz and mmWave RF tests as well as protocol tests fordevelopment of advanced 5G technologies, such as 4×4 MIMO, to increase data speeds in the sub-6 GHz band.

MediaTek announces the Helio M70 is the only 5G modem with both LTE and 5G dual connectivity (EN-DC), supporting every cellular generation from 2G to 5G. Designed for 3GPP Release 15 compliance and supporting initial non-standalone (NSA) and future standalone (SA) 5G network architectures, the Helio M70 can connect to 5G NR and 4G LTE bands worldwide while supporting High Power User Equipment (HPUE) and other key carrier features.

“Working with Anritsu, we’ve thoroughly tested our Helio M70 5G modem to ensure it’s ready for the market rollout of ultra-fast connectivity with 5G networks.” said JS Pan, General Manager of Wireless System Design and Partnership at MediaTek. “With multimode support – for 2G, 3G, 4G and 5G connectivity – Helio M70 powered devices will give consumers a seamless connectivity experience wherever they go.”

“We are working with MediaTek to help accomplish its vision of advanced 5G technology benefitting everyone.” said Yoshiyuki Amano, Anritsu’s Vice President. “Our tests with the MT8000Ahave verified that the Helio M70 makes full use of 5G maximum downlink and uplink throughput speeds.”

MediaTek’s Helio M70 is among the industry’s first wave of 5G multi-mode integrated baseband chipsets. With its multi-mode solution, the Helio M70 simplifies the design of 5G devices with a comprehensive power management plan, enabling companies to design mobile devices with a smaller form factor, improved energy efficiency and sleek appearance. The Helio M70 baseband chipset is available now, and is expected to ship in the second half of 2019.

MediaTek will be demonstrating its Helio M70 at MWC 2019, taking place Feb. 25-28, 2019 in Barcelona. MediaTek’s booth will be located in Hall 6 at Stand 6C30.