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NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset
Highlights:
NXP unveils industry-first, battery management system (BMS) chipset with built-in Electrochemical Impedance Spectroscopy (EIS) using precise...
LR 16 Click board from MIKROE designed for low-power, long-range wireless connectivity for IoT...
LR 16 Click is a new IoT and IIoT wireless connectivity Click board from MIKROE, the embedded solutions company that dramatically cuts development time by providing...
Mouser Shipping Murata LBAD0XX1SC Type 1SC CAT M1 and NB-IoT Module for Smart Wearables...
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new LBAD0XX1SC Type 1SC...
TEC 6UI Series – New 6 Watt DC/DC Converter with Ultra-Wide Input Range
The TEC 6UI series comprises isolated DC/DC converters featuring an ultra-wide input range. These next-generation converters are engineered to seamlessly replace and serve as an alternative to existing 2:1 and 4:1 input...
Join the Future of Sensing: AIS 2026 Opens Call for Research, Innovation, and Collaboration
Mark Your Calendars!The much-anticipated 3rd International Conference on AI Sensors and Transducers (AIS 2026) will be held from 2–7 August 2026 in Jeju, Korea.Present your Research:This is a great opportunity for engineers,...
Engineering the Future of Wireless: VIAVI CTO Sameh Yamany on 6G, AI-RAN, NTN, and...
In an exclusive interview with our Editor Pratibha Rawat at IMC 2025, Sameh Yamany, Chief Technology Officer, VIAVI talks about VIAVI’s network test and optimization solutions and advancements in 6G, Network Digital...
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