Renesas announced 10 New Winning Combinations integrating Celeno & Renesas Products
Comprehensive Solutions Feature Celeno's Industry-Leading Wi-Fi 6 & 6E Chipsets Combined with Renesas Embedded Processing, Power, Timing & Analog Offerings
AEC compliant Solderable System on Module based on i.MX 8XLite applications processor
iW-RainboW-G46M: The solderable i.MX 8XLite LGA System on Module is built on the OSM 1.0 Standard on a compact form factor of...
Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World
congatec introduced new Computer-on-Modules for 5G connected smart factories and industrial automation at Smart Factory & Automation World, Coex Hall C, Booth...
Build multimedia applications simply & quickly using MIKROE’ Mikromedia Smart Display Development Boards
Over 100 displays in industry's largest portfolio include touchscreen, sound IC and connectivity and feature options
MikroElektronika (MIKROE) is unveiling...
STMicroelectronics unveiled Automotive Microcontrollers for Software-Defined Electric Vehicles
STMicroelectronics has unveiled new automotive microcontrollers (MCUs) optimized for electric vehicles and centralized (domain and zonal) electronic architectures. They enable EVs to...
Features of a Successful Payroll Software Program
Calculating the payments, wages, or salaries of your employees at the end of every month has never been an easy task. You...
Power Management Solutions for next-generation Intel Xeon Processors
Infineon Technologies announced the launch of a complete power management offering for compute servers based on Intel’s Sapphire Rapids compute processing units...
Industry’s First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape
Single-Source Model for EDA & Microsoft Azure Infrastructure Delivers Flexibility with Pay-Per-Use Approach for Demanding Chip Design & Verification Needs
High-Efficiency Quasi-Resonant Power-Factor-Correction (PFC) ICs with 750 V GaN Switch
HiperPFS-5 ICs enable compact, efficient power-factor stage for ultra-fast adapters, consumer electronics, computer & appliance power supplies
Power Integrations...
Power Integrations’ HiperLCS-2 Chipset boosts LLC Resonant Power Converters efficiency
Surface-mount LLC chipset delivers 250 W with over 98 percent efficiency & no heatsink; no-load consumption is less than 50 mW
