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Here is your latest news and updates from leading electronics component manufacturer and service provider.

Farnell

Farnell and Same Sky Enter into Distribution Agreement

Farnell-Same Sky Distribution Agreement: Same Sky announced it has signed a global distribution agreement with Farnell, one of...
Summit LT150

VJ Electronix Introduces Summit LT150 Rework System for Large, High-Density Assemblies

Summit LT150 Rework System: VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray...
FAMES 2026 open access call

FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders

FAMES 2026 Open-Access Call: The FAMES Pilot Line launched its second Open-Access Call for European semiconductor stakeholders to join the groundbreaking...
Quantum Technology in Insurance Asset Management

Fujitsu launches Japan’s first defense tech open innovation program

Fujitsu Defense Tech Accelerator Program: Fujitsu Limited announced the launch of the Fujitsu Accelerator Program for Defense Tech,...
Egg Timer Electronic Components

Anglia: ‘Supply constraints are approaching – secure your position early’

Anglia Components, one of Europe's longest established independent, authorised distributors of electronic components, is actively advising customers of anticipated supply constraints in...
Quantum Technology in Insurance Asset Management

Fujitsu and DT-Axis collaborate to advance digital health

Fujitsu Limited and DT-Axis Co., Ltd. announced the commencement of a collaboration aimed at advancing digital health. The two companies have signed...
Software Radio Systems

Rohde & Schwarz acquires Software Radio Systems (SRS), specialists in software defined mobile communications...

Rohde & Schwarz acquired Software Radio Systems (SRS), a specialist in 5G software defined radio systems.This acquisition further strengthens the position of...
physical AI

TI accelerates the next generation of physical AI with NVIDIA

News highlights: TI and NVIDIA are collaborating to accelerate the path from simulation to the safe deployment...
800G and 1.6T Laser-Integrated PICs

OpenLight Receives First Volume Production Orders for NewPhotonics 800G and 1.6T Laser-Integrated PICs with...

OpenLight, a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs), announced the first-ever volume production orders by...
Huawei Exceeds ITU Partner2Connect Pledge Target

Huawei Exceeds ITU Partner2Connect Pledge Target, Bringing Connectivity to 170 Million People Globally

The announcement was made by Yang Chaobin, CEO of Huawei ICT BG, at the company's TECH Cares Forum in Barcelona. He noted...

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