Mazda, DENSO, and Toyota Sign Joint Technology Development Contract for Electric Vehicles
Mazda Motor Corporation (Mazda), DENSO Corporation (DENSO), and Toyota Motor Corporation (Toyota) signed a contract today to jointly develop basic structural technologies for electric...
Mouser Signs Global Agreement with Molex Sensorcon to Distribute Pocket-Sized Environmental Sensor Solutions
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, today announced it has entered into a global distribution agreement...
NXP Leverages Google’s Cloud IoT Core to Enable Smart Devices for Edge Computing
As an early partner for Android Things, NXP Semiconductors N.V., announced support for the public beta of Google Cloud IoT Core, a fully managed...
BlackRidge Technology Establishes Subsidiary to Commercialize New Security Technologies for Blockchain Networks
BlackRidge Technology International, Inc., a leading provider of next generation cyber defense solutions, has formed a new business subsidiary called BlackRidge Secure Blockchain to...
IHS Markit: Envelope Tracking ICs Increase Smartphone Power Efficiency, Protect Battery Life, Provide Other...
Highlights:
Battery capacity has increased twice as fast as screen size over the same period
Average smartphone screen size will peak at between 5.5...
TI Introduces The Most Accurate Single-Chip Ultrasonic Sensing Microcontrollers For Smart Water Meters
Texas Instruments (TI) today unveiled a new family of MSP430 microcontrollers (MCUs) with an integrated ultrasonic sensing analog front end that enables smart water...
Runtime Provides Commercial Support for Bluetooth Mesh; Demonstrates Estimote Mirror at Bluetooth Asia
Runtime, an IoT platform and open source solution provider, announced commercial support for Bluetooth Mesh, increasing connectivity choices for global consumers and industrial IoT...
Silicon Labs Launches Industry’s First Wireless Clocks Supporting 4G/LTE and Ethernet
Silicon Labs, has introduced a new family of high-performance, multi-channeljitter attenuating clocks for 4.5G and Ethernet-based Common Public Radio Interface (eCPRI)wireless applications.The new Si5381/82/86...
Highly Integrated,Low-Power Clock ICs from Silicon Labs Simplify Timing for Demanding 10/25/100G Designs
Silicon Labs, has introduced a new family of high-performance clock generators offering the industry’s most highly integrated timing solution for 10/25/100G applications.The new Si5332...
NB-IoT Case Studies by LinkLabs
Standardized by the Third Generation Partnership Project (3GPP) in the Release 13 LTE Advanced Pro specification in June 2016, narrowband Internet of Things (NB-IoT)...
