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Encapsulation Resins

Electrolube Launch New Encapsulation Resins at India align with local customers’ requirements

Electro-chemicals and circuit protection specialist, Electrolube are returning to India Electronics Week 2019 to showcase new encapsulation resins, thermal management products and conformal coatings...
Airborne Molecular Contamination Control

Honeycomb Chemical Filters for Airborne Molecular Contamination Control

The deteriorating quality of air is one of the most significant threats to the environment today. The deterioration is mainly caused due to two...
NVM Memory Cell

Cea-Leti and Stanford target Edge-AI Apps with Breakthrough NVM Memory Cell

Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing...
Water based fuel

Water-Based Fuel Technology to be Launched in the Netherlands

Australian-Israeli company Electriq~Global (www.Electriq.com) and Dutch company Eleqtec (www.eleqtec.com) have entered into an agreement to launch Electriq~Global's water-based fuel technology in the Netherlands. Together...
image processing components

Basler Presents Its Range of Industry 4.0 Services at Hannover Messe 2019

Basler AG presents solutions for Industry 4.0 in the areas of standard image processing components and embedded vision at Hannover Messe from April 1...
Powerline Modem Solution

Renesas Powerline Modem Solution with KNX Protocol over G3-PLC for building automation applications

Renesas Electronics Corporation has implemented KNX protocol on its G3-PLC powerline communication (PLC) solution. Based on the Powerline Modem Solution, Renesas will demonstrate a...
Stacking Technologies

2.5D & 3D Stacking Technologies for High Performance Computing, Artificial Intelligence & Datacenter

2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim,...
Augmented Reality

Cea-Leti Combines Integrated Optics & Holography in Novel Lens-Free, AR Technology

Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and...
image sensor chip

LG & Infineon to introduce LG G8ThinQ with front-facing Time-of-Flight camera

LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3...

Radiant Presents Data Comparing Imaging Sensor Performance for Pixel-Level Display Measurement

Radiant Vision Systems, a leading provider of photometric imaging solutions for light and display measurement, announces that it will present at the electronic displays Conference...

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